Analysis of CMP planarization performance for STI process.
نویسندگان
چکیده
منابع مشابه
Modeling of Advanced Integrated Circuit Planarization Processes: Electrochemical-Mechanical Planarization (eCMP), STI CMP using Non-Conventional Slurries
Progression of technology nodes in integrated circuit design is only possible if there are sustainable, cost-efficient processes by which these designs can be implemented. As future technologies are increasing device density, shrinking device dimensions, and employing novel structures, semiconductor processing must also advance to effectively and efficiently process these devices. Arguably one ...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 2001
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.67.1289